Industry News

Three -proof paint is a protective coating applied to printed circuit board assemblies(PCBAs).

Much of the favoritism toward multilayer PCBs lies in industry trends.

PCB assembly refers to the process of assembling all electronic components such as resistors, transistors, diodes, etc. onto a printed circuit board, and the assembly method can be manual or mechanical. People often confuse PCB assembly with PCB manufacturing, they involve completely different processes. As for PCB manufacturing, it involves a very wide range of processes including design and prototyping, whereas printed circuit board assembly begins after PCB fabrication and it’s all about component placement.

Rogers PCB materials have become a leading solution for engineers seeking exceptional high-frequency performance, stable dielectric properties, and dependable thermal stability.

High Density Interconnect (HDI) printed circuit boards represent a refined class of circuit board technology designed to meet the increasing demand for compact, lightweight, and high-performance electronic devices. HDI PCB structures incorporate microvias, fine traces, reduced pitch components, and multilayer stacking to deliver greater wiring density within smaller footprints. The purpose of this article is to explore what HDI PCBs are, why they are essential for today’s electronics, how they function in different applications, and what trends will shape their future development.

This article explains how PCB Fabrication, with its four major characteristics of high precision and multi-process capabilities, can adapt to the needs of the electronics industry, develop in the direction of intelligence and flexibility, and enable high-quality development of the electronics industry.