PCB assembly refers to the process of assembling all electronic components such as resistors, transistors, diodes, etc. onto a printed circuit board, and the assembly method can be manual or mechanical. People often confuse PCB assembly with PCB manufacturing, they involve completely different processes. As for PCB manufacturing, it involves a very wide range of processes including design and prototyping, whereas printed circuit board assembly begins after PCB fabrication and it’s all about component placement.
High Density Interconnect (HDI) printed circuit boards represent a refined class of circuit board technology designed to meet the increasing demand for compact, lightweight, and high-performance electronic devices. HDI PCB structures incorporate microvias, fine traces, reduced pitch components, and multilayer stacking to deliver greater wiring density within smaller footprints. The purpose of this article is to explore what HDI PCBs are, why they are essential for today’s electronics, how they function in different applications, and what trends will shape their future development.
This article explains how PCB Fabrication, with its four major characteristics of high precision and multi-process capabilities, can adapt to the needs of the electronics industry, develop in the direction of intelligence and flexibility, and enable high-quality development of the electronics industry.
Have you ever faced delays, unexpected costs, or quality issues when moving your brilliant design into production? In my two decades at the forefront of electronics manufacturing, I've seen countless projects hit frustrating snags during assembly—snags that were entirely preventable. The bridge between a perfect design and a flawlessly manufactured product is built on PCB Fabrication and assembly optimization. So, how do we ensure that bridge is strong?
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